发明名称 |
Method for manufacturing light emitting diodes including forming circuit structures with a connecting section |
摘要 |
A method for manufacturing LEDs includes following steps: forming circuit structures on a substrate, each circuit structure having a first metal layer and a second metal layer formed on opposite surfaces of the substrate and a connecting section interconnecting the first and second metal layers; cutting through each circuit structure along a middle of the connecting section to form first and second electrical connecting portions insulated from each other via a gap therebetween; arranging LED chips on the substrate and electrically connecting the LED chips to the first and second electrical connecting portions; forming an encapsulation on the substrate to cover the LED chips; and cutting through the substrate and the encapsulation between the first and second electrical connecting portions of neighboring circuit structures to obtain the LEDs. |
申请公布号 |
US8642388(B2) |
申请公布日期 |
2014.02.04 |
申请号 |
US201113332380 |
申请日期 |
2011.12.21 |
申请人 |
CHANG CHAO-HSIUNG;ADVANCED OPTOELECTRONICS TECHNOLOGY, INC. |
发明人 |
CHANG CHAO-HSIUNG |
分类号 |
H01L21/00;H01L23/12;H01L23/22;H01L23/24;H01L23/52;H01L33/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|