| 摘要 |
The present invention relates to a high luminous LED package capable of easily emitting heat generated in an LED chip by applying the thermal conductivity of a glass material which is the same as the thermal conductivity of a metal material and of improving light emitting efficiency of the LED package by guiding light generated in each side and back side of the LED chip to a front side of the LED chip and by bonding the LED chip to a reflective substrate of the glass material. The present invention is provided to supply power to the LED chip by installing an electrode in a stepped unit of a printed circuit board, thereby simplifying a manufacturing process and reducing manufacturing costs, manufacturing time, and process costs. Provided is the high luminous LED package capable of easily filling silicon filling solution and phosphor by forming an LED chip mounting unit in the upper part of the reflective plate and a border unit of the printed circuit board. The present invention comprises the reflective plate which is formed as a plate shape, one or more LED chips which are installed in the center of the upper part of the reflective plate, and the printed circuit board. The printed circuit board is installed in the border of the upper part of the reflective plate and is formed with the border unit to have the LED chip mounting unit for mounting the LED chip inside. The printed circuit board is formed by a step shaped two-layer structure in which the stepped unit is formed on each inner surface of the border unit. Each electrode is formed on the stepped unit and the upper part of another stepped unit which is faced to the stepped unit. |
