发明名称 |
Chip package and method for forming the same |
摘要 |
An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and an opposite second surface; a drain region located in the semiconductor substrate; a source region located in the semiconductor substrate; a gate located on the semiconductor substrate or at least partially buried in the semiconductor substrate, wherein a gate dielectric layer is between the gate and the semiconductor substrate; a drain conducting structure disposed on the first surface of the semiconductor substrate and electrically connected to the drain region; a source conducting structure disposed on the second surface of the semiconductor substrate and electrically connected to the source region; and a gate conducting structure disposed on the first surface of the semiconductor substrate and electrically connected to the gate. |
申请公布号 |
US8643070(B2) |
申请公布日期 |
2014.02.04 |
申请号 |
US201113314122 |
申请日期 |
2011.12.07 |
申请人 |
CHANG SHU-MING;CHEN CHIEN-HUI;HO YEN-SHIH;LIU CHIEN-HUNG;YIU HO-YIN;WEN YING-NAN |
发明人 |
CHANG SHU-MING;CHEN CHIEN-HUI;HO YEN-SHIH;LIU CHIEN-HUNG;YIU HO-YIN;WEN YING-NAN |
分类号 |
H01L29/76 |
主分类号 |
H01L29/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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