发明名称 |
Structure and process for microelectromechanical system-based sensor |
摘要 |
A structure and a process for a microelectromechanical system (MEMS)-based sensor are provided. The structure for a MEMS-based sensor includes a substrate chip. A first insulating layer covers a top surface of the substrate chip. A device layer is disposed on a top surface of the first insulating layer. The device layer includes a periphery region and a sensor component region. The periphery region and a sensor component region have an air trench therebetween. The component region includes an anchor component and a moveable component. A second insulating layer is disposed on a top surface of the device layer, bridging the periphery region and a portion of the anchor component. A conductive pattern is disposed on the second insulating layer, electrically connecting to the anchor component. |
申请公布号 |
US8643125(B2) |
申请公布日期 |
2014.02.04 |
申请号 |
US201113327681 |
申请日期 |
2011.12.15 |
申请人 |
CHEN LUNG-TAI;LIN SHIH-CHIEH;HSU YU-WEN;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHEN LUNG-TAI;LIN SHIH-CHIEH;HSU YU-WEN |
分类号 |
H01L29/78 |
主分类号 |
H01L29/78 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|