发明名称 |
Interconnection designs and materials having improved strength and fatigue life |
摘要 |
Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter. |
申请公布号 |
US8642462(B2) |
申请公布日期 |
2014.02.04 |
申请号 |
US20080100380 |
申请日期 |
2008.04.09 |
申请人 |
STERRETT TERRY LEE;HARRIES RICHARD J.;MICORN TECHNOLOGY, INC. |
发明人 |
STERRETT TERRY LEE;HARRIES RICHARD J. |
分类号 |
H01L21/44;B29C39/02;B29C70/58;B29C70/88;C08J5/10;C08L101/12;H01L23/485;H05K3/32 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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