| 摘要 |
The present invention relates to a repair and reinforcement method for water leakage of a heat exchanger for manufacturing a semiconductor which comprises a plurality of linear pipes, which transfers refrigerants inside for heat exchange, and a plurality of head bands, which are inserted into and welded to a pipe expansion part of the linear pipes to connect the linear pipes and more specifically, to a repair and reinforcement method for water leakage of a heat exchanger for manufacturing a semiconductor comprising an operation confirmation step for confirming the operation of the heat exchanger; a location confirmation step for confirming the location of the water leakage of the heat exchanger; and a water leakage repairing step for repairing the location of the water leakage. The present invention is provided to confirm the operation of the heat exchanger and the location of the water leakage, thereby repairing and reinforcing the location of the water leakage by using an individually appropriate repair method. |
