The present invention provides a semiconductor element test device which easily tests the electrical property and reliability of a POP structure and a lower semiconductor package structure using a pusher having a double-sided structure. The semiconductor element test device comprises: a body unit of a polygonal pillar shape; a first pattern formed on a first side of the body unit; a second pattern which is formed on a second side of the body unit and is different with the first pattern; a pusher block including a first combination unit formed on top and bottom of the body unit; a socket pin connected with an external terminal of a semiconductor element; a socket which is arrange to be faced with the pusher block; a first opening in which the pusher block is inserted; and a socket cover which is combined with the socket by a hinge.
