发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method which can cause microphase separation of various induced self-organization materials properly.SOLUTION: An underlying layer L1 is formed to cover the upper surface of a substrate W, and a guide pattern L2 is formed on the underlying layer L1. In a region on the underlying layer L1 where the guide pattern L2 is not formed, a DSA film L3 composed of two kinds of polymers is formed. While supplying a solvent to the DSA film L3 on the substrate W, the DSA film L3 is heat treated. Consequently, microphase separation of the DSA film L3 takes place. As a result, pattern P1 consisting of one polymer and pattern P2 consisting of the other polymer are formed. The pattern P2 is removed by subjecting the DSA film L3 sequentially to exposure processing and development processing after the microphase separation.
申请公布号 JP2014022570(A) 申请公布日期 2014.02.03
申请号 JP20120159917 申请日期 2012.07.18
申请人 SOKUDO CO LTD 发明人 HARUMOTO MASAHIKO;MIYAGI SATOSHI;INAGAKI YUKIHIKO;KANAYAMA KOJI
分类号 H01L21/027;G03F7/30 主分类号 H01L21/027
代理机构 代理人
主权项
地址