| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a high frequency circuit that can reduce transmission loss of an electric signal for high-frequency use and has high adhesion between a resin layer and a metal foil, and is low in dielectric constant, dielectric loss tangent, and hygroscopicity of the resin layer.SOLUTION: A substrate for a high frequency circuit comprises a laminate including a resin layer and a metal foil laminated on at least one main surface of the resin layer, The resin layer is formed of a heat-hardened body of varnish including a polyamic acid, a fluororesin, and an organic solvent, the polyamic acid being obtained by subjecting (a) diamine represented by the formula (1), (b) specific aromatic diamine except the component (a), (c) aromatic tetrabasic acid dianhydride, and (d) aromatic tetrabasic acid dialkyl ester to reaction. |
