SOLID-STATE IMAGING ELEMENT, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To allow for compatibility between smear suppression and good transfer characteristics.SOLUTION: A solid-state imaging element comprises a semiconductor substrate and a plurality of pixel units provided on the semiconductor substrate. The pixel unit comprises: a photoelectric conversion unit which generates an electric charge on the basis of incident light; a memory unit which stores the generated electric charge; a light-shielding unit which shields at least the memory unit; an excavated part excavated in the semiconductor substrate between the photoelectric conversion unit and the memory unit and formed of a light-shielding material; and a transfer unit which transfers the electric charge from the photoelectric conversion unit to the memory unit when a channel for transfer is formed in the excavated part. This technique is applicable to an electronic device with an imaging function.