| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer treatment device or the like in which a fluid flowing in a fluid supply path with a state change can be supplied to a treatment container in which a wafer is treated, while removing a foreign substance in the fluid.SOLUTION: A fluid supply section supplies a fluid passing through a fluid supply path 351 to a treatment container 31 which is provided for treating a wafer W by a supercritical fluid or a subcritical fluid in such a manner that the fluid passes while being changed from a source fluid in a gaseous state to a supercritical state or a subcritical state. In the fluid supply path 351, a first filter 41 is provided for removing a foreign substance in the fluid, and a second filter 42 is provided for removing an aggregate of foreign substances flowing out to a fluid resulting from changing the source fluid into a liquid state, the supercritical state or the subcritical state after adsorption by the first filter 41 when the source fluid in the gaseous state passes. |
