发明名称 FITTING STRUCTURE OF ON-VEHICLE ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a fitting structure for fitting a casing 2 housing an electronic device to a body 12, capable of reducing impedance between the casing and the body not bound by the shape of the casing or the like.SOLUTION: The proximate place of a casing 2 and a body 12 is surrounded with a surrounding wall 6, and a space surrounded with the surrounding wall is filled a particle group 10. The particle group having a conductive surface is used. Each particle is compressed more than a natural shape, and pressurized to fill until a state where a returning force to the natural state is applied. The particle group 10 pressurized to fill adheres to both the casing 2 and the body 12 to reduce impedance between the casing 2 and the body 12. This fitting structure is not bound by the shape of the casing 2 or the like.
申请公布号 JP2014019325(A) 申请公布日期 2014.02.03
申请号 JP20120160609 申请日期 2012.07.19
申请人 NIPPON SOKEN INC;TOYOTA MOTOR CORP 发明人 KIDA YOSHIHIRO;HATTORI TOSHIHIRO;FUKAGAWA YASUHIRO;SUGITA MASAYUKI
分类号 B60R16/02;H05K5/02;H05K9/00 主分类号 B60R16/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利