| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer etching method capable of etching the surface to be etched of a wafer to a uniform state.SOLUTION: A wafer etching method comprises the steps of: rotatably holding a wafer by a rotation holding device 10; and supplying an etchant to at least a central part of a wafer 1 by etchant supply means 20 and etching the wafer 1 by rotating it. The etching step etches an outer periphery of the wafer 1 at a higher temperature than a temperature of the central part of the wafer 1. |
