发明名称 PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plating device having a shielding member capable of fluidly dealing with the various appearances of the plating deviation of the object to be plated, and effective for the reduction of process time and the reduction of process cost.SOLUTION: The plating device 100 comprises: a plating tank 110 storing a plating liquid and charged with the object 200 to be plated; an anode(s)120 oppositely arranged on one side or both the sides of the object 200 to be plated; and a shielding member 130 arranged between the object 200 to be plated and the anode(s) 120, composed of a first plate 131 and a second plate 133 adjacently arranged to the first plate 131, and in which the first plate 131 and the second plate 133 or the first plate 131 and the second plate 133 mutually parallelly move.
申请公布号 JP2014019946(A) 申请公布日期 2014.02.03
申请号 JP20120208231 申请日期 2012.09.21
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 RO YU JOHN;KIM CHUL KYU
分类号 C25D21/12;C25D17/00;H01L21/288 主分类号 C25D21/12
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