发明名称 RESIN COMPOSITION FOR PUTTY, AND PUTTY OBTAINED BY CURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for a putty, having appropriate hardness and satisfying aspects of dimensional accuracy, adhesion and abradability.SOLUTION: A resin composition for a putty contains (A) an unsaturated polyester resin, (B) an ethylenically unsaturated monomer, (C) a low constrictive agent and (D) a filler, and (C) the low constrictive agent is an A-B type block copolymer containing an A segment which is a polymer based on a monomer containing vinyl acetate and a B segment which is a polymer based on styrene, and a percentage of the A segment in the A-B type block copolymer is 30 to 50 mass% and a percentage of B segment is 70 to 50 mass%, and a number average molecular weight of the A-B type block copolymer is 10,000 to 100,000.
申请公布号 JP2014019836(A) 申请公布日期 2014.02.03
申请号 JP20120162095 申请日期 2012.07.20
申请人 NOF CORP 发明人 NISHIMA KEISUKE;UCHIDA ATSUSHI;TASAKA TOMOHISA
分类号 C09K3/10;C08F283/01 主分类号 C09K3/10
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