发明名称 |
HEAT TRANSFER STRUCTURE USING BINDER FOR RBSC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<p>Disclosed are a heat transfer structure by using binder for bonding a reaction bonded silicon carbide (RBSC) pellet and a manufacturing method thereof which are capable of preventing a damage of connecting part while manufacturing or operating the heat transfer structure; maintaining a property of the RBSC pellet; shortening a time for shaping and processing. The structure and the method are a medium of exchanging the high temperature and the low temperature; and are connected with Si1-xRx binder (R represents solid solution material; x represents atomic weight ratio) which is a silicon solid solution, and connects multiple units which comprise RBSC pellet.</p> |
申请公布号 |
KR20140012383(A) |
申请公布日期 |
2014.02.03 |
申请号 |
KR20120079085 |
申请日期 |
2012.07.20 |
申请人 |
SKC SOLMICS CO., LTD. |
发明人 |
HWANG, SUNG SIC;SOHN, NYUNG KYUNG |
分类号 |
C04B37/00;C04B37/02 |
主分类号 |
C04B37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|