发明名称 HEAT TRANSFER STRUCTURE USING BINDER FOR RBSC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
摘要 <p>Disclosed are a heat transfer structure by using binder for bonding a reaction bonded silicon carbide (RBSC) pellet and a manufacturing method thereof which are capable of preventing a damage of connecting part while manufacturing or operating the heat transfer structure; maintaining a property of the RBSC pellet; shortening a time for shaping and processing. The structure and the method are a medium of exchanging the high temperature and the low temperature; and are connected with Si1-xRx binder (R represents solid solution material; x represents atomic weight ratio) which is a silicon solid solution, and connects multiple units which comprise RBSC pellet.</p>
申请公布号 KR20140012383(A) 申请公布日期 2014.02.03
申请号 KR20120079085 申请日期 2012.07.20
申请人 SKC SOLMICS CO., LTD. 发明人 HWANG, SUNG SIC;SOHN, NYUNG KYUNG
分类号 C04B37/00;C04B37/02 主分类号 C04B37/00
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