EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a build-up insulating film which exhibits a low permittivity and a low dielectric tangent, an insulating film formed therefrom, and a multilayer printed circuit board having the same.SOLUTION: An epoxy resin composition for a build-up insulating film comprises: an epoxy resin (A); an acid anhydride curing agent (B) having a ratio of molar polarizability/molar volume of 0.6 or less and including a fluorine group or methyl group in a molecule thereof with a symmetric molecular structure; an inorganic filler (C); and a curing accelerator (D).