| 摘要 |
PROBLEM TO BE SOLVED: To enable the temperature of an upper electrode to be kept uniform in a plasma processing apparatus.SOLUTION: An upper electrode 4 which is disposed so as to confront a susceptor 24 provided in a processing chamber 21 has a plate-like member 41 and an electrode portion 42. A gas flow hole 43a through which processing gas used for plasma processing is made to flow is formed in the plate-like member 41. Silicon is spray-coated onto a surface at the flow-out side of the gas flow hole 43a of the plate-like member 41 to form the electrode portion 42 like a membrane. |
