发明名称 PROCESS MONITOR ELEMENT, AND METHOD FOR MANUFACTURING MEMS ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a process monitor element in which a gauge for monitoring degrees of release etching in a MEMS element manufacturing process does not become a particle to stably monitor a degree of release etching.SOLUTION: A process monitor element 100 is one in a MEMS element manufacturing process for forming a plurality of MEMS elements having MEMS vibrators to be formed by performing release etching to a sacrifice layer on a principal plane of a wafer substrate 1, and comprises: a monitor sacrifice layer 30 which is distributed on the principal plane of the wafer substrate 1 and is composed of the sacrifice layer; a resist layer 31 laminated on the monitor sacrifice layer 30; an etching hole 32 which is formed in the resist layer 31 to expose the monitor sacrifice layer 30; and a gauge 40 by which a position of an etching interface 30a of the monitor sacrifice layer 30 etched by etching liquid to be introduced from the etching hole 32 is relatively watched from the principal plane side of the wafer substrate 1.
申请公布号 JP2014018871(A) 申请公布日期 2014.02.03
申请号 JP20120156273 申请日期 2012.07.12
申请人 SEIKO EPSON CORP 发明人 INABA SHOGO;SATO AKIRA
分类号 B81C1/00 主分类号 B81C1/00
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