发明名称 METHOD FOR MANUFACTURING METAL CORE-INSERTED PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal core-inserted printed circuit board.SOLUTION: The present invention relates to a method for manufacturing two printed circuit boards through one process by attaching a foam tape to each of a first CCL and a second CCL including copper foil layers having thicknesses different each other. A method for manufacturing a metal core-inserted printed circuit board according to an embodiment of the present invention includes the steps of: preparing a first CCL (Copper Clad Laminate) and a second CCL including copper foil layers having thicknesses different each other; joining the first CCL and the second CCL via a joining member; etching each of the upper surface of the first CCL and the lower surface of the second CCL to form a groove; and separating the first CCL and the second CCL from the joining member under a preset temperature to section into a first printed circuit board and a second printed circuit board including a metal core.
申请公布号 JP2014022741(A) 申请公布日期 2014.02.03
申请号 JP20130148240 申请日期 2013.07.17
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 SON SANG HYUK
分类号 H05K3/46 主分类号 H05K3/46
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