发明名称 METHOD FOR ELECTRON BEAM WELDING WITHOUT BACKING PLATE
摘要 The present invention relates to an electron beam welding method without a backing plate and more specifically, to an electron beam welding method without a backing plate, which can obtain excellent bonding effect even without a backing plate by performing a second welding on one surface of a base material after a first welding on the other surface of the base material. Provided is an electron beam welding method without a backing material, in particular, an electron-beam butt welding which makes the base materials to abut and to be bonded with each other and includes a first welding step performing an electron beam welding on the surface of the base material with a melting width of 2.5 to 3.5 mm over the entire welding depth; and a second welding step performing the electron beam welding on the other surface of the base material by 20 to 40% of the entire welding depth with a melting width wider than the melting width in the first welding step. Therefore, the present invention can reduce post-treatment without inconvenience of removing a backing material after the electron beam welding.
申请公布号 KR20140012292(A) 申请公布日期 2014.02.03
申请号 KR20120078726 申请日期 2012.07.19
申请人 HYUNDAI HEAVY INDUSTRIES CO., LTD. 发明人 SUNG, HEE JOON;KIM, TAE SEOK;PARK, KYUNG HO;KIM, KYEONG JU
分类号 B23K15/00 主分类号 B23K15/00
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