发明名称 PLASMA PROCESSING APPARATUS AND CALIBRATION METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus whose components are replaced and which has elapsed time or a plasma processing apparatus which, among a plurality of plasma processing apparatuses, can be calibrated with respect to a plurality of processing conditions and also to provide a calibration method therefor.SOLUTION: In a calibration method, one apparatus parameter of plasma generating conditions is sequentially changed as a reference, a plurality of apparatus parameters of the other plasma generating conditions are respectively sequentially changed with respect to such a sequential change as the reference, and data of an apparatus sensor capable of grasping a plasma state is grasped (S12 to S15). Also in the calibration method, an off-set value is grasped by comparing the data of the apparatus sensor with that of the other apparatus (S16), and plasma generating conditions are adjusted based on the off-set value (S17). Moreover, the apparatus is provided which realizes the calibration method.
申请公布号 JP2014022695(A) 申请公布日期 2014.02.03
申请号 JP20120163169 申请日期 2012.07.24
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 SONODA YASUSHI;SUMIYA MASAHIRO;TANAKA MOTOHIRO
分类号 H01L21/3065;H01L21/205;H01L21/31;H05H1/00;H05H1/46 主分类号 H01L21/3065
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