FLEXIBLE CIRCUIT CLAD LAMINATE, PRINTED CIRCUIT BOARD USING IT, AND METHOD OF MANUFACTURING THE SAME

摘要

Provided in the present invention is a copper clad laminate for a flexible circuit which has excellent properties such as etching properties, a splitting resistance, and curl properties. The copper clad laminate for a flexible circuit according to the present invention includes a polymer film, a tiecoat layer formed on at least one side of the polymer film, and a copper (Cu) layer formed on the tiecoat layer. The tiecoat layer comprises an alloy containing 12.0-70.0 weight% of molybdenum (Mo) and the rest of nickel (Ni).