发明名称 RELAY BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a relay board capable of imparting high reliability by preventing damage to a relay board body.SOLUTION: A relay board 31 comprises a relay board body 39 of a substantially plate shape and a plurality of conductor posts 36 penetrating between a board principal surface 32 and a board rear surface 33 of the relay board body 39. A semiconductor element mounting region 24 in which a plurality of semiconductor element connection terminals 37 for mounting a semiconductor element exist is set on the board principal surface 32. A covering material 61 covering at least a part of a board side surface 34 is tightly formed on a board side surface 34 of the relay board body 39. The covering material 61 protrudes to the board principal surface 32 side and includes a salient 62 disposed around the semiconductor element mounting region 24.
申请公布号 JP2014022483(A) 申请公布日期 2014.02.03
申请号 JP20120158297 申请日期 2012.07.17
申请人 NGK SPARK PLUG CO LTD 发明人 IWASAKI MASATAKA;YAMAMOTO HIROSHI
分类号 H01L23/32;H01L23/28 主分类号 H01L23/32
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