LIQUID ENCAPSULATION MATERIAL, AND ELECTRONIC COMPONENT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a liquid encapsulation material that is excellent in PCT(pressure cooker testing) resistance; and an electronic component in which the liquid encapsulation material is used to encapsulate an encapsulation region.SOLUTION: A liquid encapsulation material includes: (A) a liquid epoxy resin; (B) a curative; (C) a silica filler; and (D) a coupling agent, and the liquid encapsulation material is characterized in that an average value of a boron content of (C) the silica filler is 1-50 ppm.