| 摘要 |
PROBLEM TO BE SOLVED: To clean a substrate with a cleaning fluid without removing the substrate holder from a plating device, further, without wetting an electrical contact provided in the substrate holder, while driving the plating device.SOLUTION: The plating device comprises: a plating tank of holding a plating liquid at the inside; a substrate carrying apparatus of discharging a substrate before plating from a substrate cassette mounted on the device and returning the substrate after plating to the substrate cassette; a substrate holder 18 of sealing the outer circumferential part of the surface of the substrate discharged from the substrate cassette with a sealing member and dipping the same into the plating liquid in the plating tank while detachably holding the substrate; a dummy substrate DW arranged at a position in which the substrate carrying apparatus can access; and substrate holder cleaning tanks 26a, 26b of feeding the cleaning liquid to the inside, sealing the outer circumferential part of the surface of the dummy substrate with the sealing member, dipping the substrate holder freely detachably holding the dummy substrate and performing cleaning. |
