| 摘要 |
PROBLEM TO BE SOLVED: To prevent chip breaking in a semiconductor device manufacturing process to improve reliability of the semiconductor device.SOLUTION: A semiconductor device comprises: a sacrificial region 100 provided on an outer peripheral region of a seal ring 200 bent in an L-shape in a chip corner region; a plurality of L-shaped aluminum distributions 124A arranged in top layer wiring 104 in the sacrificial region so as to open an internal circuit region 300; and a plurality of L-shaped metal distributions 40 arranged in a middle layer in the sacrificial region similarly to the top layer wiring. |
