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发明名称
具积体电子元件之半导体发光装置
摘要
诸如矽二极体、电阻器、电容器及电感器之一或多个电路元件置于一半导体发光装置之半导体结构与用以将该装置连接至一外部结构之连接层之间。在某些实施例中,至该半导体结构之n型接点分布于多个通道上,该等n型接点藉由一或多个介电层与p型接点绝缘。该等电路元件形成于接点-介电层-连接层堆叠中。
申请公布号
TWI425651
申请公布日期
2014.02.01
申请号
TW096113664
申请日期
2007.04.18
申请人
飞利浦露明光学公司 美国
发明人
杰络墨 钱德 巴特;史蒂芬T 伯斯
分类号
H01L33/00
主分类号
H01L33/00
代理机构
代理人
陈长文 台北市松山区敦化北路201号7楼
主权项
地址
美国
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