| 摘要 |
An assembly including a first component having a first side and a second side opposite the first side, the first side having at least one bonding structure extending therefrom and spaced from an outer perimeter of the first component, and a second component having a first side and a second side opposite the first side, the second component thermally bonded to the first component along at least one interior interface including said bonding structure, said interface fully enclosed between the first and second components. At least a portion of at least one of the first or second components is laser transparent to allow passage of laser energy through said laser transparent portion to a laser opaque portion of the interface, said laser opaque portion configured to absorb laser energy to facilitate bonding. |
