MODULE, AND PRODUCTION METHOD THEREFOR

摘要

The purpose of the present invention is to provide a module exhibiting excellent heat dissipation characteristics, and a production method for said module. A module (2) is provided with: a wiring board (11); a semiconductor substrate (9) mounted on one main surface (11a) of the wiring board (11); pillar-shaped connection terminals (8) provided to the one main surface (11a) in an upright manner; and a resin layer (13a) which is provided to the one main surface (11a), and which partially covers side surfaces of the semiconductor substrate (9) and side surfaces of each of the connection terminals (8) such that a bottom-surface (9a) side end of the semiconductor substrate (9) and bottom ends of the connection terminals (8) are exposed. The bottom ends of the connection terminals (8) and the bottom-surface (9a) side end of the semiconductor substrate (9), which have greater thermal conductivity than the resin of the resin layer (13a), are exposed from a surface of the resin layer (13a). As a result, the module (2) exhibiting excellent heat dissipation characteristics can be achieved.