| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which secures heat radiation performance from an element and in which an interface does not exist in a resin provided at a substrate, and to provide a semiconductor device manufacturing method capable of manufacturing the semiconductor device at low costs.SOLUTION: An element 16 on a substrate 14 is sealed by a seal resin part 22. A heat transfer particle containing resin part 24 containing heat transfer particles 28, which has heat conductivity higher than that of a base material resin 26, is disposed at a position separated from the element 16 in the base material resin 26 having compatibility with the sealing resin part 22. The base material resin 26 is integrated with the seal resin part 22. |
