| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein is a printed circuit board including: a substrate; one or more elastic electrode formed on the substrate and made of an elastic material; and one or more metal electrode formed on the elastic electrode. |
| 申请公布号 |
US2014027161(A1) |
申请公布日期 |
2014.01.30 |
| 申请号 |
US201213677076 |
申请日期 |
2012.11.14 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE KIWON |
| 分类号 |
H05K1/09;H05K1/02 |
主分类号 |
H05K1/09 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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