发明名称 |
BONDING METHOD USING POROSIFIED SURFACES FOR MAKING STACKED STRUCTURES |
摘要 |
A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material. |
申请公布号 |
US2014030847(A1) |
申请公布日期 |
2014.01.30 |
申请号 |
US201213559626 |
申请日期 |
2012.07.27 |
申请人 |
KOTLANKA RAMA KRISHNA;KUMAR RAKESH;CHIRAYARIKATHUVEEDU SANKARAPILLAI PREMACHANDRAN;LIN HUAMAO;YELEHANKA PRADEEP;GLOBALFOUNDRIES SINGAPORE PTE. LTD. |
发明人 |
KOTLANKA RAMA KRISHNA;KUMAR RAKESH;CHIRAYARIKATHUVEEDU SANKARAPILLAI PREMACHANDRAN;LIN HUAMAO;YELEHANKA PRADEEP |
分类号 |
H01L21/762 |
主分类号 |
H01L21/762 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|