| 摘要 |
The present disclosure relates to a semiconductor light-emitting device, comprising: a supporting substrate having a first side and a second side reverse from the first side; at least one semiconductor laminate formed on the first side, said at least one semiconductor laminate having a plurality of semiconductor layers; a bonding layer for bonding a second semiconductor layer from among the plurality of semiconductor layers to the first side of the supporting substrate; and a bonding layer-removed surface, which is formed on the first side, opened toward the plurality of semiconductor layers, and arranged to supply current to the plurality of semiconductor layers. |
