| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-profile semiconductor device at low cost.SOLUTION: A semiconductor device 1 includes a semiconductor element 2, an insulating resin 3 provided so as to be in contact with a second surface 2b of the semiconductor element 2, and a sealing member 4 sealing the semiconductor element 2 and the insulating resin 3. The insulating resin 3 is exposed on a second surface 1b of the semiconductor device 1. The semiconductor element 2 has a high-profile portion 7 having a distance D1 between the high-profile portion 7 and a first surface 1a of the semiconductor device 1, and a low-profile portion 8 having a distance D2 larger than the distance D1 between the low-profile portion 8 and the first surface 1a of the semiconductor device 1. The insulating resin 3 extends from the second surface 2b of the semiconductor element 2 to a first surface 8a of the low-profile portion 8. |
