| 摘要 |
PROBLEM TO BE SOLVED: To provide rolled copper foil having improved bent part deposition resistance, and a copper-clad laminate using the same.SOLUTION: The copper foil uses oxygen free copper comprising 30 to 100 ppm Sn as a base material, the area ratio of the (200) face in the main surface after heat treatment at 300°C for 5 min is 0.65 or higher, and the copper foil has a thickness t of 5 to 50 μm. |
