发明名称
摘要 <p>In one embodiment, an integrated circuit (IC) is presented. The IC includes first and second sets of power distribution lines formed in the IC. The IC includes first and second capacitors formed in one or more layers of the IC. A first plurality of vias couple a first input of the first and second capacitors to the first set of power distribution lines, and a second plurality of vias couple a second input of the first and second capacitors to the second set of power distribution lines. The first capacitor and the first plurality of vias and the second plurality of vias coupled thereto having an equivalent series resistance greater than an equivalent series resistance of the second capacitor and the first plurality of vias and the second plurality of vias coupled thereto.</p>
申请公布号 JP2014502428(A) 申请公布日期 2014.01.30
申请号 JP20130543172 申请日期 2011.10.28
申请人 发明人
分类号 H01L21/822;H01L21/82;H01L27/04 主分类号 H01L21/822
代理机构 代理人
主权项
地址