FLOW PATH MEMBER, AND HEAT EXCHANGER AND SEMICONDUCTOR MANUFACTURING DEVICE USING SAME

摘要

[Problem] To provide a flow path member that improves reliability and a heat exchanger and semiconductor manufacturing device using the same. [Solution] The present invention is provided with: a first wall part (1); a second wall part (2); and a third wall part (3) provided between the first wall part (1) and the second wall part (2). An inside part constituted by the first wall part (1), the second wall part (2), and the third wall part (3) forms a flow path in which a liquid flows. A plurality of flow path openings (4) for the flow path are provided lined up in one direction in a cross-sectional plane when the cross-section is made from the first wall part (1) across the second wall part (2). Since one of adjacent flow path openings (4) is disposed so as to be offset to the first wall part (1) side or the second wall part (2) side more than the other, stress concentration between the corners of adjacent flow path openings can be relaxed, and the flow paths are difficult to damage, forming a flow path member (10) with improved reliability.