Method for manufacturing microelectromechanical system element of component, involves spanning rear connection opening in substrate under membrane structure, producing cavity in substrate and opening cavity by backside thinning of substrate

摘要

The method involves spanning a rear connection opening (17) in a substrate (1), and producing a cavity (12) in the substrate using the surface micromechanical process under the membrane structure (11), particularly an acoustically active membrane. The cavity is opened by backside thinning of the substrate. An etching access opening (41) is generated in the layer structure in the area of the membrane structure, which extends to the substrate. The cavity is generated, in which the substrate material is removed in the area under the membrane structure. An independent claim is included for a component with a housing and a microelectromechanical system element forming a portion of a housing wall.