| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit board which can improve yield by reducing chip cracks caused by a stress.SOLUTION: In an electronic circuit board 1 including a substrate 5 on which a pattern of a conductor is formed and a chip type electronic component 4 which is solder mounted across a pair of lands 2 each composed of a conductor in a longer direction, the land 2 includes a setting part 2a within a width of the electronic component 4 in a shorter direction, which has an edge 2b of the conductor on an extended line in the longer direction of the electronic component 4 for setting the electronic component 4. When assuming that a width of the setting part in the shorter direction of the electronic component is Wa and a length of the setting part 2a in the longer direction of the electronic component 4 is L, the following equation is satisfied: La<Wa/2. |
