发明名称 ADHESIVE MEMBER, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide: an adhesive member in which followability of an adherend to convexoconcave is further improved while squeeze-out of the adhesive member to a lateral direction is suppressed; and a manufacturing method of an electronic component using the adhesive member.SOLUTION: An adhesive member 10 is an adhesive member that includes a thermosetting resin such as an epoxy resin, and an energy ray-curable resin such as an acryl resin, and has a cured or semi-cured, cured part 10a at some parts. A first adherend is adhered with a second adherend through the partially cured or semi-cured adhesive member 10, the whole of the adhesive member 10 in which the first and second adherends are adhered is cured by heat to produce an electronic component such as a semiconductor device. The cured part 10a performs a function of a dam when being adhered, thereby squeeze-out of an adhesive member 10 to the lateral direction is suppressed.
申请公布号 JP2014015519(A) 申请公布日期 2014.01.30
申请号 JP20120152930 申请日期 2012.07.06
申请人 HITACHI CHEMICAL CO LTD 发明人 INADA TEIICHI
分类号 C09J201/00;B32B7/12;C09J7/02;C09J11/00 主分类号 C09J201/00
代理机构 代理人
主权项
地址