LEAD FRAME, PRE-MOLD LEAD FRAME, SEMICONDUCTOR DEVICE, PRE-MOLD LEAD FRAME MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a high-quality lead frame by reducing failure occurring in gate break after resin molding.SOLUTION: A lead frame which is filled with a resin with being clamped by a mold comprises: blank parts to be filled with the resin; a first half-etching part provided at a position corresponding to a gate of the mold for injecting the resin into the blank parts; and a second half-etching part provided at a position corresponding to an air vent of the mold for exhausting air from the blank parts when the resin is injected into the blank parts.