发明名称 METHOD AND APPARATUS FOR INSPECTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To perform inspections in respective positions of the front surface and the back surface of a substrate without having them interfere with each other.SOLUTION: An apparatus for inspecting substrates inspects a substrate 1, by irradiating, obliquely in a moving direction X, the relatively moving substrate 1 with long-shaped inspection light 10 where a direction orthogonal to the moving direction becomes a longitudinal direction, and receiving scattering light scattered from the substrate. The width of the long-shaped inspection light in a short direction is made to be smaller than the board thickness of the substrate so that an inspection light-irradiated area on the front surface of the substrate and an inspection light-emitting area on the back surface of the substrate do not overlap each other in a direction of the board thickness of the substrate. This allows inspections for foreign matter detection on both front and back surfaces to be performed without having them interfere with each other.
申请公布号 JP2014016325(A) 申请公布日期 2014.01.30
申请号 JP20120155960 申请日期 2012.07.11
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 IWAI SUSUMU;YAMAGUCHI KIYOMI
分类号 G01N21/958 主分类号 G01N21/958
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