发明名称 CONNECTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a connector device capable of reducing the stress generated at spring portion for electrical connection or engagement holding.SOLUTION: A flexible film substrate 11 comprises connecting through holes 14A and coupling through holes 14B formed for inserting connecting posts and engagement posts formed on a header. Around the connecting through hole 14A, a connecting pad 12A to be electrically connected to the connecting post is formed; and around the coupling through hole 14B, a coupling pad 12B to be electrically connected to the coupling post is formed. The film substrate 11 is connected to the connecting through hole 14A and the coupling through hole 14B at one end and is formed with groove holes 15A and 15B extending along a plane direction of the film substrate 11. In an area at the other end side of the groove holes 15A and 15B in the surface of the film substrate 11, no-pad area 17A or 17B is formed where the connecting pad 12A or the coupling pad 12B is not formed.
申请公布号 JP2014017155(A) 申请公布日期 2014.01.30
申请号 JP20120154692 申请日期 2012.07.10
申请人 PANASONIC CORP 发明人 IWANO HIROSHI;IIDA MITSURU;SATO DAISUKE;TAKEYAMA HIDETOSHI
分类号 H01R12/79 主分类号 H01R12/79
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