| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin mold apparatus capable of improving filling property of a resin mold when a molding having a projection part is subjected to resin molding.SOLUTION: While a release film 12 having a specified height is held in the adsorbed state with a prescribed tension by suction from a first air hole 13 on the cavity bottom part of a first cavity recessed part 7, a mold resin R is filled into the first cavity recessed part 7; and while the release film 12 is extended into a second cavity recessed part 8 by applying the final resin pressure which is higher than the tension of the release film 12, the mold resin R is filled into the second cavity recessed part 8. |
