发明名称 COMPUTER SYSTEM COOLING USING AN EXTERNALLY-APPLIED FLUID CONDUIT
摘要 A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.
申请公布号 US2014029193(A1) 申请公布日期 2014.01.30
申请号 US201213560617 申请日期 2012.07.27
申请人 ALSHINNAWI SHAREEF F.;CUDAK GARY D.;HARDEE CHRISTOPHER J.;HUMES RANDALL C.;ROBERTS ADAM;SUFFERN EDWARD S.;WEBER J. MARK;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ALSHINNAWI SHAREEF F.;CUDAK GARY D.;HARDEE CHRISTOPHER J.;HUMES RANDALL C.;ROBERTS ADAM;SUFFERN EDWARD S.;WEBER J. MARK
分类号 G06F1/20 主分类号 G06F1/20
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