发明名称 |
A ONE-COMPONENT, DUAL-CURE ADHESIVE FOR USE ON ELECTRONICS |
摘要 |
The disclosure relates to one-component, dual-cure adhesive compositions that include a combination of moisture curable functionalities and radiation curable functionalities where the adhesive could include (1) a moisture-curable prepolymer and a radiation-curable component; or (2) a moisture curable radiation curable prepolymer including moisture curable functionalities and radiation curable functionalities, and optionally an additional moisture-curable prepolymer and/or an additional radiation- curable component. The disclosed adhesives can be used on substrates with electronic components to make electronic assemblies. |
申请公布号 |
WO2013016133(A3) |
申请公布日期 |
2014.01.30 |
申请号 |
WO2012US47393 |
申请日期 |
2012.07.19 |
申请人 |
H.B. FULLER COMPANY;GIORGINI, ALBERT, M. |
发明人 |
GIORGINI, ALBERT, M. |
分类号 |
C09J5/00;H01L21/67;H01L23/00 |
主分类号 |
C09J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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