发明名称 |
METHOD OF FORMING A LIGHT EMITTING DIODE MODULE |
摘要 |
<p>A light emitting diode module includes a transparent semiconductor having a refractive index of 2.7 ± 1.2, a polymer layer disposed on the transparent semiconductor and having a refractive index of 1.5 ± 0.1, and a compositional graded coating (CGC) disposed on the transparent semiconductor and sandwiched between the transparent semiconductor and the polymer layer. The CGC has a thickness and a refractive index varying along the thickness from a first refractive index from (2.2 ± 0.5 to 3.3 ± 0.4) at a first end to a second refractive index of 1.5 ± 0.2 at a second end adjacent to the polymer layer. The CGC also includes a gradient including SiC:H and (SiOCN:H; SiOC:H; and/or Si:H) along the thickness. The module is formed by continuously depositing the CGC on the transparent semiconductor using chemical vapor deposition, and subsequently disposing the polymer layer on the CGC.</p> |
申请公布号 |
WO2014018122(A1) |
申请公布日期 |
2014.01.30 |
申请号 |
WO2013US33103 |
申请日期 |
2013.03.20 |
申请人 |
DOW CORNING CORPORATION;DOW CORNING TORAY CO. LTD. |
发明人 |
DESHAZER, DAVID;LOBODA, MARK, J.;OGAWA, TAKUYA;ZAMBOV, LUDMIL |
分类号 |
H01L33/56;C23C16/32;C23C16/36;C23C16/42;H01L33/00 |
主分类号 |
H01L33/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|