MOUNTING DEVICE AND MEASURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mounding device capable of performing measurement adjustment for obtaining a preferred mounting result even in mounting a large-sized chip.SOLUTION: A contact pin is buried in a surface of a substrate stage. A mounting part is lowered so that a nozzle suction surface is brought into contact with a tip of the contact pin, and a relative movement amount between the mounting part and a mounting unit in such a case is determined. A degree of parallelization between the substrate stage and the nozzle suction surface can be numerically obtained by determining the relative movement amount at a plurality points within the nozzle suction surface.