| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method which can bond two substrates without causing generation of voids and further with good accuracy of several tens of micrometers and under when bonding the two substrates.SOLUTION: A substrate bonding method comprises: a pin arrangement process (S19) of arranging a plurality of pins on peripheries of a first substrate (W1) and a second substrate (W2); an overlapping process (S20) of aligning and overlapping the first substrate (W1) and the second substrate (W2); a preliminary pressure application process (S33) of preliminarily applying pressure to the overlapped first substrate and second substrate; and a pin extraction process (S35-S37) of extracting the pins from the peripheries of the first substrate and the second substrate while observing a gap between the first substrate and the second substrate by an observation part (CA4) during the preliminary pressure application process. |
